Congress Book

About the Electronics, Communications, and Computing Summit  Series

The Electronics, Communications, and Computing Summit  is a multidisciplinary academic and industrial platform committed to fostering innovation, collaboration, and knowledge exchange in the rapidly evolving domains of electronics, telecommunications, and computing technologies. Hosted quarterly under the aegis of the Society for Communication and Computer Technologies (SCCTS), the summit aims to bridge the gap between theoretical advancements and real-world engineering applications.

Each volume in the Electronics, Communications, and Computing Summit  series showcases rigorously reviewed research contributions, technical notes, and thought leadership articles that explore novel methodologies, architectures, and applications across the following focus areas:

Core Themes and Scope

  • Advanced Electronics: Semiconductor device innovations, embedded system design, VLSI, MEMS/NEMS, sensor interfaces, and nanoelectronics.

  • Next-Generation Communication Systems: 5G/6G technologies, wireless networks, IoT, satellite and optical communication, network security, and RF design.

  • High-Performance Computing and Software Engineering: AI/ML integration, cloud and edge computing, quantum computing, blockchain, robotics, and real-time embedded operating systems.

  • Interdisciplinary Applications: Smart healthcare, sustainable energy systems, automotive and aerospace electronics, digital twin modeling, and cyber-physical systems.

Summit Objectives

  • To disseminate state-of-the-art innovations in electronics, communication, and computing.

  • To facilitate collaboration between academic researchers, industry professionals, and government agencies.

  • To promote early-career researcher contributions and recognize emerging research talent through peer-reviewed publication opportunities.

  • To document seasonal advancements with quarterly volumes (Spring, Summer, Autumn, and Winter editions).

Structure and Editorial Format

Each volume of the Electronics, Communications, and Computing Summit  follows a thematic structure featuring:

  • Original Research Articles

  • Review and Perspective Papers

  • Short Communications

  • Case Studies and Industrial Reports

The editorial process is overseen by a diverse international board comprising scholars, practitioners, and industry advisors, ensuring relevance, technical rigor, and global engagement.